Case Study： Fused Silica Furnace Tube-Amy
Yayınlanmıştır: June 24, 2026
1. Client Background
A manufacturer of 8-inch power semiconductors uses vertical diffusion furnaces at 1050–1180°C for oxidation and doping. Strict requirements on material purity, infrared transmittance and devitrification resistance.
2. Original Issues with Ordinary Silica Tubes
The former JGS1 flame-polished tubes caused multiple production defects:
- High OH content leads to poor infrared penetration and uneven temperature field, lowering wafer yield.
- High metal impurities trigger rapid devitrification and frequent cracking; tubes need replacement every 45 days.
- Matte flame-polished nuts result in poor vacuum sealing and unstable process gas concentration.
3. Optimized Solution: FS03 Silica Tubes
- Material: FS03 vacuum fused silica, SiO₂ ≥99.995%, OH⁻ ＜10 ppm, ultra-low impurities.
- Surface: Fully clear mirror polishing for tubes, flanges and quartz nuts (no flame polishing).
- Structure: Thickened wall, stress-relieved welding for high thermal shock resistance.
4. Test & Production Results
- Temperature difference inside furnace reduced from ±12°C to ±3°C.
- Wafer yield up 6.8%; service life extended from 45 days to 180 days.
- Vacuum leakage failures dropped by 95%; fewer production halts for tube replacement.
5. Conclusion
FS03 clear polished furnace tubes solve temperature uniformity and contamination risks, cut maintenance cost and boost stable mass production for semiconductor thermal processes.
